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Displacement Dryer - List of Manufacturers, Suppliers, Companies and Products

Displacement Dryer Product List

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IPA vapor condensation replacement drying device

IPA vapor condensation replacement drying device

IPA vapor condensation replacement drying device suitable for the drying of ultra-thin Si device manufacturing.

We propose our IPA vapor drying device, which has been developed with a focus on preventing the occurrence of watermarks on substrate surfaces, a common issue in various semiconductor and electronic device manufacturing processes. Additionally, this device serves as a rational cleaning and drying apparatus that not only dries optical and uneven parts requiring clean drying but also performs a high-purity finishing wash using distilled IPA simultaneously. 【Features】 ■ One of the largest market shares in the world ■ Safe design ■ Watermark-free drying ■ Clean drying ■ Capable of drying a wide range of materials, etc. *For more details, please download the PDF or contact us.

  • Drying Equipment

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Vacuum gas replacement drying device

Vacuum gas replacement drying device

Vacuum gas replacement drying device enabling clean gas atmosphere circulation fan heating in a low-oxygen environment.

Efficient gas replacement through vacuum exhaust rapidly reduces the oxygen concentration in the processing chamber, enabling clean gas atmosphere circulation fan heating in a low-oxygen environment.

  • Vacuum Equipment

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IPA mist direct replacement drying device

IPA mist direct replacement drying device

IPA mist direct replacement drying device utilizing IPA vaporless and Marangoni convection.

We propose the "Watermarkless Drying Device," developed through our many years of experience in the design and manufacturing of IPA vapor drying equipment, along with the know-how we have cultivated through numerous case studies, utilizing IPA vapor-less drying and Marangoni convection for continuous improvement. By directly replacing the IPA after cleaning the Si wafer, we can achieve a surface free of water droplets without exposing it to the atmosphere, allowing for a direct replacement of the Si wafer surface from "pure water to IPA." 【Features】 ■ Watermarkless drying ■ Suppression of particle re-adhesion ■ IPA vapor-less ■ Reduction in IPA consumption ■ Capable of drying a wide range of materials ■ Customized design to meet customer needs *For more details, please download the PDF or contact us.

  • Drying Equipment

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IPA Mist Direct Replacement Drying Device 'IMD IIID'

IPA Mist Direct Replacement Drying Device 'IMD IIID'

Utilizing the Marangoni effect! Developed for the drying of thin wafers in power device manufacturing.

When using our conventional product "IMD III" for drying thin wafers, a problem arose where adjacent wafers came into contact when separating the wafer from the carrier, leading to inadequate drying. The "IMD IIID" holds the upper part of the wafer immediately after it emerges from the pure water surface, following the start of the drying process with pure water withdrawal. By subsequently separating the wafer from the carrier, it prevents contact between wafers, providing drying capabilities equivalent to carrierless drying. 【Features】 ■ Watermark-free drying ■ Marangoni drying using pure water withdrawal method ■ Drying of thin wafers, which is difficult with conventional drying methods ■ Reduction in IPA consumption (10-20cc/1 batch) ■ Capable of drying 3” to 8” wafers *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment

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